US 8,747,070 6/10/2014 SPINNING HORIZONTAL AXIS TURBINE Blonder Greg E

• A wind turbine whose blades follow a figure 8 pattern as they rotate around the drive axle. This arrangement is more resistant to turbulence than a typical three-blade, horizontal lift design, and more efficient and capital efficient than a simple drag blade arrangement. High efficiency lift-blade designs are only suited for sites with consistent wind profiles. This invention is more efficient in a wider range of sites. More details at Spinorwind.

US 7,964,883 6/21/2011 LIGHT EMITTING DIODE PACKAGE ASSEMBLY THAT EMULATES THE LIGHT PATTERN PRODUCED BY AND INCANDESCENT BULB Mazzochette, Amaya, Lin, Blonder

• A design for an LED lightbulb where the LEDs are mounted on a thermally conductive substrate, and the LEDs are arranged to produce a spherically uniform output. In some cases the LEDs are mounted on opposite side of one or two board, and some LEDs are located in a refelctor ring.

US 5,574,258 11/12/96 HEAT-SHRINK CRIMPING DEVICE AND METHOD G.Blonder

• Heat shrink tubing with an internal wire mesh, so the tubing creates an insulated, electrical splice in one step.

US 5,382,300 01/17/95 SOLDER PASTE MIXTURE Blonder Greg E; Degani Yinon; Dudderar Thomas D

• A solder paste for the assembly of electronic devices to printed circuit boards, which eliminates an industry-wide problem of solder ball formation. Solder balls often lead to electrical failure and other quality concerns.

US 5,252,434 10/12/93 METHOD FOR FORMING A SLOPED SURFACE HAVING A PREDETERMINED SLOPE Blonder Greg E

• General lithographic technique to contollably slope a thin film. Useful for optical waveguides, 2-D lenses, I.C. wiring,...

US 5,149,404 09/22/92 FINE LINE SCRIBING OF CONDUCTIVE MATERIAL; DETERMINING LINEWIDTH BY ELECTRIC FIELD Blonder Greg E; Fulton Theodore A

• By dragging a fine tip across a metal film while applying a voltage, a narrow groove of material is removed. Suited for making photomasks, decorative products, metal screens,..

US RE33651 07/30/91 VARIABLE GAP DEVICE AND METHOD OF MANUFACTURE Blonder Greg E; Lamola Angelo A; Lieberman Robert A, and

US 4,937,653 06/26/90 SEMICONDUCTOR INTEGRATED CIRCUIT CHIP-TO-CHIP INTERCONNECTION SCHEME Blonder Greg E; Fulton Theodore A

• Instead of using wirebonds or solder to attach bare silicon I.C.s to a substrate, we employ small gold pads and textured mating surfaces to cold weld the two parts together. Advantages include low inductance, room temperature assembly, no chemical fluxes and high strength.

US 4,617,608 10/14/86 VARIABLE GAP DEVICE AND METHOD OF MANUFACTURE Blonder Greg E; Lamola Angelo A; Lieberman Robert A

• A thin film optical cavity is formed such that electricity or pressure can deform the cavity and change its color via optical interference. Suitable for blood pressure sensors, displays, electrostatic relays,..